Laser ablation is a process where the laser beam removes material locally from a solid substrate. Depending on the intensity in the focal spot, the heated material evaporates, sublimates, or is converted to a plasma. The applied energy depends on the absorption of the material for the particular laser wavelength and can be precisely controlled by laser parameters, such as power, spot size, and pulse length. Laser ablation can be performed with continuous wave and pulsed laser beams, the latter being the most common form. The excellent controllability opens a wide field of applications reaching from the removal of debris and dust from artifacts, the stripping of paint and the removal of thin layers from various substrates to the machining and drilling of metals, ceramics and polymers.
Visotek diode lasers are excellent sources for fast and precise material removal, specifically in the field of paint stripping and selective removal of thin layers with little or no thermal impact on the surrounding material. Compared to conventional cleaning techniques, the process involves no chemicals and therefore is environmentally friendly. High-power diode lasers provide sufficient intensities to process larger spots with a single pulse and fast beam steering via scanning optics enable efficient processing of larger components.